EngineeringOn site
Advanced Packaging Substrate Supplier Enablement Lead
IntelPhoenix, AZ
$164,100–231,670/yr
Posted Sep 22, 2026
What you’d do
Lead substrate supplier development and qualification for advanced packaging technologies such as high density FCBGA, EMIB-T and glass core substrate. Drive technical enablement, manage readiness milestones, and work with cross functional engineering teams and supplier partners. Full time. Found on the employer's careers page on Sep 29, 2026. Apply through the link.
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