EngineeringEntry levelOn site
Packaging Module Development Engineer
IntelPhoenix, AZ
$133,800–188,890/yr
Posted Sep 16, 2026
What you’d do
Entry-level engineering role on Intel's Advanced Packaging Technology & Manufacturing team in Chandler, Arizona, developing semiconductor packaging modules. Full time position. Found on the employer's careers page on Sep 29, 2026. Apply through the link.
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