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3DIC Platform Wet and Plating Development Manager

IntelHillsboro, OR

$180,770–255,200/yr

Posted Oct 8, 2026

What you’d do

Lead a team of process engineers developing wet etch, clean, and plating processes for 3DIC advanced packaging technologies such as Foveros Direct, Foveros, and EMIB. Full time role based in Hillsboro, Oregon, combining team management with hands-on technical work. Found on the employer's careers page on Oct 9, 2026. Apply through the link.

You’ll need

  • Experience managing process engineers
  • Wet etch/clean process development
  • Plating process development
  • Advanced packaging/3DIC experience

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