Panel Packaging Technology Enablement Director

What you’d do

Director role focused on panel packaging technology enablement, requiring direct experience with panel-format processing, glass core substrates, through-glass vias, or fine-line RDL, plus familiarity with AI accelerator and HPC package architectures. Full time in Santa Clara, CA. Found on the employer's careers page on Oct 17, 2026. Apply through the link.

You’ll need

• Panel-format processing experience
• Glass core substrates or through-glass vias experience
• Fine-line RDL at sub-5 µm line/space
• AI accelerator and HPC package architectures
• Chiplet integration and HBM co-packaging familiarity