EngineeringOn site
Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
NVIDIASanta Clara, CA
Posted Sep 23, 2026
What you’d do
Analyze power, thermal, and packaging constraints against product roadmaps, and develop cross-domain solutions spanning silicon, packaging, firmware, and hardware co-design. Full time in Santa Clara, CA. Found on the employer's careers page on Sep 29, 2026. Apply through the link.
Our summary of the listing. The full listing has the details.