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Advanced Packaging Metrology Engineering Manager

IntelHillsboro, OR

$155,520–255,200/yr

Posted Sep 29, 2026

What you’d do

Manage a metrology engineering team supporting advanced packaging technology development at Intel's Wafer-Level Assembly Technology Development group. Full time role based in Hillsboro, Oregon. Found on the employer's careers page on Sep 29, 2026. Apply through the link.

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