Senior Principal Packaging Engineer

What you’d do

Define package architectures, materials, and assembly processes for semiconductor products, and lead cross-functional programs through NPI and NTI from feasibility to production ramp. Full time in Chandler, with possible international travel to assembly sites and suppliers. Found on the employer's careers page on Oct 21, 2026. Apply through the link.

You’ll need

• B.S. or higher in Mechanical, Materials, Chemical, or Electrical Engineering or related
• 10+ years in semiconductor packaging development or related
• Package design and assembly process development
• Cross-functional program leadership
• International travel