Senior Package Modeling Engineer

NVIDIASanta Clara, CA

Apply on NVIDIA’s site

Posted Sep 10, 2026

What you’d do

Perform finite element analysis to assess stress, warpage, and thermo-mechanical behavior in advanced semiconductor packaging, and evaluate new materials and interconnect concepts. Full time, based in Santa Clara, CA. Found on the employer's careers page on Sep 29, 2026. Apply through the link.

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