EngineeringHybrid
Principal Engineer, Hybrid Bonding Module
IntelHillsboro, OR
$211,400–298,440/yr
Posted Jun 1, 2026
What you’d do
Define and scale die-to-wafer hybrid bonding for advanced packaging, from first-of-a-kind platform development through qualification, ramp, and high-volume manufacturing. Full time, based in Hillsboro, Oregon. Found on the employer's careers page on Sep 29, 2026. Apply through the link.
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