Packaging Engineering Intern MS/PhD

What you’d do

Intern will assist in design, development, and analysis of semiconductor packaging technologies including Wirebond, Flip Chip, Modules, and SIPs. Work involves material, mechanical, thermal, and electrical characterization to support product differentiation. Found on the employer's careers page on Oct 23, 2026. Apply through the link.

You’ll need

• Pursuing Masters in Mechanical, Materials, Chemical, Optical, Electrical Engineering or related
• 3.0/4.0 GPA or higher
• Coursework or research in semiconductor packaging/fabrication
• Experience with AutoCAD design
• Experience with FEM modeling