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TD Media and Collaterals Development Engineer
IntelPhoenix, AZ
$85,200–120,280/yr
Posted Sep 24, 2026
What you’d do
Develop and optimize assembly media and collaterals for semiconductor packaging, running experiments and reliability tests for heat, humidity, temperature cycling, and dynamic forces. Full time role in Phoenix, Arizona. Found on the employer's careers page on Sep 29, 2026. Apply through the link.
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