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Experimental Thermal & Advanced Packaging Senior Scientist - R&D

ToyotaAnn Arbor, MI

Posted Sep 21, 2026

What you’d do

Leads hands-on experimental research and in-house prototype development in advanced electronics packaging and thermal management. Designs, builds, and validates hardware and test methods for power-electronic, optoelectronic/silicon-photonic, and quantum-device applications. Full time. Found on the employer's careers page on Oct 18, 2026. Apply through the link.

You’ll need

  • PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Applied Physics, or relate
  • 5 years professional experience in advanced electronics packaging, power electronics, semiconductor

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