EngineeringOn site
Module Engineer On Shift (MEOS)
IntelPhoenix, AZ
$85,200–162,500/yr
Posted Oct 15, 2026
What you’d do
Develop and optimize assembly and packaging processes for next-generation semiconductor products on Intel's Epoxy MEOS team in Arizona. Full-time shift-based role focused on quality, reliability, and performance of packaging technology. Found on the employer's careers page on Oct 17, 2026. Apply through the link.
You’ll need
- Semiconductor packaging/assembly process experience
- Relevant engineering education
- Full-time shift availability
- On-site in Phoenix, Arizona
Our summary of the listing. The full listing has the details.