Sr. Package Engineer, Annapurna Labs - AI Silicon Packaging

What you’d do

Drive semiconductor package technology development for next-generation Trainium AI systems, from concept through volume production. Work with OSATs and suppliers on qualification, reliability, and yield, and represent packaging in cross-functional design reviews. Found on the employer's careers page on Oct 20, 2026. Apply through the link.

You’ll need

• Bachelor's in materials science, mechanical, electrical, or chemical engineering
• Or 10+ years related industry experience
• Package technology development experience
• OSAT and supplier coordination
• Cross-functional technical team coordination