EngineeringOn site
Product Engineering Architect (3D IC, Heterogeneous Integration & Advanced Packaging)
CadenceSan Jose, CA
$185,500–344,500/yr
Posted Oct 7, 2026
What you’d do
Provide senior technical leadership for Cadence Virtuoso Heterogeneous Integration technologies, shaping product strategy and roadmap for 3D IC, heterogeneous integration and advanced packaging physical implementation flows. Partner with customers, product management, R&D and application engineering, and lead early customer engagements. Full time. Found on the employer's careers page on Oct 18, 2026. Apply through the link.
You’ll need
- BS in Electrical Engineering, Electronics, or related technical field
- Deep expertise in semiconductor design or physical implementation
- Expertise in advanced packaging or EDA product engineering
- Customer-facing technical leadership
Our summary of the listing. The full listing has the details.