MTS 3D Heterogenous Integration Engineer

What you’d do

Drive 3D heterogeneous integration process development for advanced packaging, including multi-die stacking and fine-pitch hybrid bonding, plus thermal solutions for next-generation semiconductor products. Full time role partnering with process, manufacturing, and vendor teams. Found on the employer's careers page on Oct 21, 2026. Apply through the link.

You’ll need

• Master's in EE, ME, ChemE, Materials Science or related
• 5-6 years prior related work experience
• 3D heterogeneous integration / advanced packaging process development
• Thermal solution and package-level heat removal experience
• Process integration and planning across multiple programs