EngineeringOn site
Packaging Module Development Engineer
IntelPhoenix, AZ
$115,110–219,550/yr
Posted Oct 15, 2026
What you’d do
Develops and sustains metrology systems, measurement methods, and inspection equipment for advanced packaging and Thermal Compression Bonding, improving process control, yield, and manufacturability. Full time in Phoenix, Arizona. Found on the employer's careers page on Oct 17, 2026. Apply through the link.
You’ll need
- Minimum education requirements as stated in posting
- Metrology systems and measurement methods experience
- Process control and manufacturing data analytics
- Thermal Compression Bonding (TCB) technology knowledge
- Equipment specification and calibration
Our summary of the listing. The full listing has the details.