Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs

What you’d do

Design and develop thermal and mechanical packaging systems for semiconductor hardware used in AWS data centers, from circuit design to high volume manufacturing. Full-time position in Austin, Texas. Found on the employer's careers page on Oct 23, 2026. Apply through the link.

You’ll need

• Master's degree in mechanical engineering or equivalent
• 3+ years industry experience in advanced packaging of semiconductors
• Experience communicating with customers, technical, regulatory, business teams, and management