EngineeringOn site
Packaging Module Development Engineer
IntelPhoenix, AZ
$133,800–188,890/yr
Posted Sep 9, 2026
What you’d do
Develops and optimizes assembly processes and equipment for semiconductor packaging, running experiments and data analysis to meet quality, yield, and reliability goals. Full time role in Phoenix, Arizona. Found on the employer's careers page on Sep 29, 2026. Apply through the link.
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