Advanced Packaging TD Plating Module Engineer

What you’d do

Develop and optimize advanced semiconductor manufacturing processes, including material selection, equipment metrology, and system design. Conduct feasibility studies and simulations, and drive process innovation for next-generation device architectures. Full time in Hillsboro, Oregon. Found on the employer's careers page on Oct 8, 2026. Apply through the link.

You’ll need

• Industry-relevant job experience, internships, or schooling in semiconductor process development
• Experience with advanced manufacturing process development
• Knowledge of material selection and equipment metrology
• Experience conducting feasibility studies and simulations