EngineeringOn site
Oregon Advanced Packaging Module Engineer - Laser
IntelHillsboro, OR
$89,010–125,660/yr
Posted Oct 23, 2026
What you’d do
Engineer for Oregon Advanced Packaging team supporting wafer-level processes and packaging technologies at Intel's Aloha and Ronler factories. Full-time role focused on manufacturing solutions and technology transfer in wafer packaging. Found on the employer's careers page on Oct 23, 2026. Apply through the link.
You’ll need
- Experience in advanced packaging or wafer-level processes
- Ability to support high-volume manufacturing
- Experience with technology transfer
- Full-time schedule
- Located in Oregon
Our summary of the listing. The full listing has the details.