EngineeringOn site
Advanced Packaging Process Engineer III (E3)
Applied MaterialsSanta Clara, CA
$124,000–171,000/yr
Posted Sep 29, 2026
What you’d do
Designs and runs process engineering experiments, characterizes hardware, and troubleshoots complex packaging issues using root cause analysis. Requires BS/MS in engineering or related field and 4-7 years experience, including W2W and D2W bonding. Found on the employer's careers page on Oct 18, 2026. Apply through the link.
You’ll need
- BS or MS in Electrical, Chemical, or Mechanical Engineering, Materials Science, Physics, or related
- 4-7 years of related experience
- Experience with electronic packaging fabrication such as W2W and D2W bonding
- Complex problem solving and root cause analysis
- Full time
Our summary of the listing. The full listing has the details.