Sr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging

What you’d do

Lead package-level signal and power integrity analysis for 2.5D, 3D-IC, fan-out, and silicon interposer architectures, including high-speed channel simulations and PDN optimization. Full-time role in Austin, Texas. Found on the employer's careers page on Sep 30, 2026. Apply through the link.