EngineeringEntry levelOn site
Packaging Module Equipment Development Engineer
IntelPhoenix, AZ
$133,800–188,890/yr
Posted Oct 26, 2026
What you’d do
This entry-level role in Intel's Advanced Packaging Technology Manufacturing group involves developing semiconductor packaging equipment to support mobile, edge, and high-performance computing applications. The position is full time in Phoenix, Arizona. Found on the employer's careers page on Oct 26, 2026. Apply through the link.
You’ll need
- Entry-level position
- Work in semiconductor packaging equipment development
- Full-time schedule
- Located in Phoenix, Arizona
- Bachelor's degree or relevant experience
Our summary of the listing. The full listing has the details.