EngineeringHybrid
Semiconductor Packaging Integration Research Manager
IntelPhoenix, AZ
$220,920–311,890/yr
Posted Sep 11, 2026
What you’d do
Lead advanced semiconductor packaging integration research, covering heterogeneous integration, chiplets, 2.5D/3DIC, hybrid bonding, and wafer-level packaging. Full time role guiding concepts from research through feasibility and technology transfer. Found on the employer's careers page on Sep 29, 2026. Apply through the link.
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