Signal and Power Integrity Intern, MS - Summer 2027

What you’d do

This full-time summer 2027 internship involves advanced packaging design for photonic fabric products, focusing on signal and power integrity and physical designs for optical data center interconnects. Found on the employer's careers page on Oct 26, 2026. Apply through the link.

You’ll need

• Currently enrolled in Bachelor's or Master's in Electrical Engineering or related
• Expected graduation Fall 2027 – Summer 2028
• Prior coursework in electronics, circuit design, and programming
• Knowledge of circuit design and analysis
• Understanding of chip physical integration and layout concepts