EngineeringEntry levelOn site
Packaging Module Development Engineer
IntelPhoenix, AZ
$133,800–188,890/yr
Posted Oct 23, 2026
What you’d do
Develop and commercialize semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms in Intel's Advanced Packaging Technology Manufacturing division. This is an entry-level full-time role. Found on the employer's careers page on Oct 23, 2026. Apply through the link.
You’ll need
- Entry-level position
- Work in semiconductor packaging technology
- Full-time schedule
- Located in Phoenix, Arizona
Our summary of the listing. The full listing has the details.