Ph.D. Intern - Advanced Packaging & Physical Integration

What you’d do

Ph.D. intern on the advanced packaging team, working on physical integration of compute silicon, high-bandwidth memory, optical I/O, and die-to-die interconnects for AI accelerators and custom XPUs. Full time. Found on the employer's careers page on Oct 21, 2026. Apply through the link.

You’ll need

• Ph.D. candidate
• Hands-on research experience in semiconductor packaging, signal integrity, or related physical desig