EngineeringOn site
Package Engineer, Annapurna Labs - AI Silicon Packaging
AmazonTempe, AZ
Posted Oct 22, 2026
What you’d do
Develop and manage packaging technology for next-generation Trainium AI silicon systems, collaborating with suppliers and internal teams to optimize performance, cost, and reliability from concept to production in a full-time role. Found on the employer's careers page on Oct 22, 2026. Apply through the link.
You’ll need
- Bachelor's in Materials Science, Mechanical, Electrical, or Chemical Engineering or 6+ years related
- Experience with package technology development
- Collaboration with suppliers and cross-functional teams
- Knowledge of performance, cost, yield, manufacturability tradeoffs
- Full-time schedule
Our summary of the listing. The full listing has the details.