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Package Engineer, Annapurna Labs - AI Silicon Packaging

AmazonTempe, AZ

Posted Oct 22, 2026

What you’d do

Develop and manage packaging technology for next-generation Trainium AI silicon systems, collaborating with suppliers and internal teams to optimize performance, cost, and reliability from concept to production in a full-time role. Found on the employer's careers page on Oct 22, 2026. Apply through the link.

You’ll need

  • Bachelor's in Materials Science, Mechanical, Electrical, or Chemical Engineering or 6+ years related
  • Experience with package technology development
  • Collaboration with suppliers and cross-functional teams
  • Knowledge of performance, cost, yield, manufacturability tradeoffs
  • Full-time schedule

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