EngineeringHybrid
Packaging Module Development Engineer
IntelPhoenix, AZ
$115,110.00-219,550.00/yr
Posted Oct 21, 2026
What you’d do
Develop and optimize metrology inspection recipes, design desktop software to interface with precision hardware, and create automated analysis tools for semiconductor packaging manufacturing in a full-time role in Chandler, Arizona. Found on the employer's careers page on Oct 21, 2026. Apply through the link.
You’ll need
- Experience in metrology engineering
- Skills in data analytics
- Engineering software development
- Full-time schedule
- Location: Chandler, Arizona
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