EngineeringEntry levelOn site
Packaging Module Development Engineer
IntelPhoenix, AZ
$133,800–188,890/yr
Posted Sep 17, 2026
What you’d do
Develop and qualify advanced semiconductor packaging processes, materials, and equipment to meet reliability, yield, and cost targets in high-volume manufacturing. Full time, entry level, based in Phoenix, Arizona. Found on the employer's careers page on Sep 29, 2026. Apply through the link.
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